Diamond H1 Wafer Handling Robot

Wafer Size
2”(50mm) to 12”(300mm)

Payload
2.2 lbs(1.0 kg)

Encoders
Incremental, 10000 pulse/rev

Motor type
Brushless, low inertia high response

Weight
40.7 lbs(18.5 kg) for 7” vert. travel, and 5.25”x5.25” arm

Operating temperatures
50°F-104°F (10°C to 40°C)

Facility requirements
Voltage range
100-120AVC, 200-240VAC
Vacuum supply
11.8”Hg(-5.8psi) / 0.1CFM airflow

Axis	Motion range	Max Velocity	Max Acceleration	Axis Repeatability
T	> 360° (typical +/-230°)	>360 °/s	1500 °/s²	±0.01°
R	From ±10.5” Up to ±14.4” (depending on arm)	Up to 35 inch/s (depending on arm size)	300 inch/s²	±0.001” (0.025mm)
Z	7”	>18 inch/s	44 inch/s²	±0.001” (0.025mm)