Diamond H3 Wafer Handling Robot

Wafer Size
2”(50mm) to 12”(300mm)

Payload
2.2 lbs (1.0 kg)

Encoders
Incremental, 10.000 pulse/rev

Motor type
Brushless, low inertia high response

Weight
62 lbs (28 kg) for 13” vert. travel, and 7.2”x7.2” arm

Operating temperatures
50°F-104°F (10°C to 40°C)

Facility requirements
Voltage range
100-120AVC, 200-240VAC
Vacuum supply
11.8” Hg(-5.8psi) / 0.1CFM airflow

Axis	Motion range	Max Velocity	Max Acceleration	Axis Repeatability
T	> 360° (typical +/-230°)	360 °/s	1500 °/s²	±0.01°
R	From ±10.5” Up to ±17.5” (depending on arm)	Up to 50 inch/s (depending on arm size)	300 inch/s²	±0.001” (0.025mm)
Z	From 13” up to 21” (depending on robot body model)	18 inch/s	44 inch/s²	±0.001” (0.025mm)