Wafer Handling Robot with Track
Wafer Handling Robot with Track
Wafer Handling Robot with Track

H4 PLUS WAFER HANDLING ROBOT

The Diamond H4 Plus series Dual-Arm atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment. Two independent arms (R1 and R2) attached to a common royalty axis (T) allow fast swapping or simultaneous transfer of two wafers.

Atmosphere Dual Arm Vertical Travel 13" CE Certificate TUV Certificate S2 Certificate S28 Certificate
  • ▶  Excellent structural rigidity
  • ▶  Modular and highly customizable design
  • ▶  Variety of End Effector options

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    Manufactured by Milara Inc. USA and designed by Logosol Inc. USA

    Additional Information

    The Diamond H4 Plus series Dual-Arm atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment. Two independent arms (R1 and R2) attached to a common royalty axis (T) allow fast swapping or simultaneous transfer of two wafers. Benefiting from technologically superior components, the robots utilize ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive® gears to achieve greatly enhanced dexterity and precision. The innovative, all-in-one, class 1 clean room compatible design incorporates the motion controller, servo amplifiers, and power supply within the robot’s industry standard footprint. High-strength structural members enable top, bottom or side mount configurations without compromising the system rigidity. A 32-bit, real-time kernel delivers accurate motion profiling along smooth continuous trajectories, while the distributed control architecture allows a seamless integration with linear tracks, prealigners, and other sub-components. Networkable RS-485 and Ethernet interfaces complement the standard RS-232 and teach pendant connections. Powerful native wafer handling and scripting languages facilitate rapid software development for embedding the robots into an OEM application environment. Comprehensive emulation of legacy robot “macro” commands offers a drop-in compatibility with a wide variety of existing semiconductor

    • Wafer Size 2”(50mm) to 12”(300mm)
    • Payload 2.2 lbs(1.0 kg) per arm
    • Encoders Incremental, 131072 pulse/rev
    • Motor type Brushless, low inertia high response
    • Weight 120 lbs(55 kg)
    • Operating temperatures 50°F-104°F (10°C to 40°C)
    • Facility requirements Voltage range 100-120AVC, 200-240VAC, Vacuum supply 11.8”Hg(-5.8psi) / 0.1CFM airflow